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Active Isolation Enhancer and Interference Canceller
QHx220
Electromagnetic Interference (EMI) is emerging as a major concern in next generation wireless communication systems. As wireless terminals now support multiple services and features that utilize high data rates simultaneously, removing interference within wireless terminals like handsets has become a challenge. Reducing the Electromagnetic Interference recovers the receiver sensitivity, enabling simultaneous operation of multiple radios, and improves the overall quality of service of communication devices. Intersil's QHx220 is situated in a handset to sample the source of the noise and emulate the RF coupling channel between the noise source and victim receiver antenna. In doing so, an anti-noise signal can be applied directly to the victim receive path to cancel the EMI and achieve the signal integrity benefits. This approach makes it possible to cancel both in-band (within the victim Rx band) or out-of-band aggressors. This is a revolutionary approach since it is only possible to cancel out of band noise using conventional Rx filters. In addition QHx220 may be used to increase the inherent isolation between antennas or inside duplexers and switches, thus allowing to increase the transmit power in repeaters or yielding higher sensitivity in the receivers. Both measures finally resulting in a better coverage, larger cell size, smaller antennas or lower power of infrastructure components such as basestations, pico-and Femtocells as well as repeaters. The QHx220 integrates the sampler path LNA gain stages as well as the DACs required to control the I and Q control voltages (used to set the magnitude and phase of the cancellation signal). Both the gain, and control voltages are programmable using a SPI bus interface.
QHx220
Features
* Protocol agnostic. Designed for: GSM, CDMA, DVB-H, ISDB-T, DMB * Frequency Range 300MHz to 3GHz * Integrated, programmable LNA gain stages in the sampler path * SPI bus controlled integrated DACs * >20dB Noise Cancellation is possible * 50dB typical Dynamic Range * Low Power Consumption (<20mW typical, ~2W standby) * Ultra Small ~ 1mm2 devices are available as tested bumped die or 3x3mm2 QFN package
Applications
* Most any wireless device with a local aggressor: - Cell phones - Mobile TV devices - Laptop Computers - GPS terminals - Pico- and Femtocells * Improved Tx to Rx Isolation of devices (i.e. duplexer, switches) or between neighboring antennae * Basestations * Linearization of PAs
Typical Application Circuit
Benefits
* Actively cancels unwanted local RF noise * Improves BER, receiver sensitivity, C/N by canceling noise generated from local aggressors * Improves isolation between adjacent antennas * Can be used to cancel in-band or out-of-band interferers (i.e. spurs, harmonics, phase noise, or other noise sources like IM products generated in a PA) * Enables simultaneous operation of multiple co-located radios * Improves overall quality of service
FIGURE 1. ACTIVE ISOLATION ENHANCER AND NOISE CANCELLER
October 20, 2009 FN6986.0
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CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. 1-888-INTERSIL or 1-888-468-3774 | Intersil (and design) is a registered trademark of Intersil Americas Inc. Copyright Intersil Americas Inc. 2009. All Rights Reserved All other trademarks mentioned are the property of their respective owners.
QHx220
Ordering Information
PART NUMBER (Note 1) QHX220IQT7 QHX220IQSR Coming Soon QHX220ICT7 (Note 2) Coming Soon QHX220ICSR (Note 2) NOTES: 1. These Intersil Pb-free plastic packaged products employ special Pb-free material sets, molding compounds/die attach materials, and 100% matte tin plate plus anneal (e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations). Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020. 2. Contact Intersil Marketing for availability. PART MARKING QH220 QH220 220 220 TEMP. RANGE (C) -40 to +85 -40 to +85 -40 to +85 -40 to +85 PACKAGE (Pb-Free) 16 Ld QFN 7" Prod. Tape & Reel; Qty 1,000 16 Ld QFN 7" Sample Reel; Qty 100 9 Ball CSP 7" Prod. Tape & Reel; Qty 1,000 9 Ball CSP 7" Sample Reel; Qty 100 PKG. DWG. # L16.3x3B L16.3x3B TBD TBD
Pin Configurations
QHx220 (16 LD QFN) TOP VIEW
VDDA2 GND2 1 GND A GND1 1 SAMPLER IN 2 GND1 3 ENBAR 4 5 VDDA 6 CLK 7 DATA 8 EXTR 12 GND2 INDUCTOR 11 RF OUT B 10 GND2 9 BUS ENABLE C VDD RF OUT BUSEN DATA CLK IND NC
QHx220 (9 BALL CSP) TOP VIEW
2 RF IN 3 ENBAR
16
15
14
13
Pin Descriptions
QFN PIN # 1, 3, 10, 12, 16 2 4 5, 13 6 7 8 9 11 14 15 QFN PIN NAME GNDx SAMPLER IN ENBAR VDDx CLK DATA EXTR BUS ENABLE RF OUT NC IND Exposed Center Pad CSP PIN # 1A 2A 3A 1C 3B 2B 3C 2C 1B CSP PIN NAME GND RF IN ENBAR VDD CLK DATA BUSEN RF OUT INDUCTOR Ground RF Input Enable (active low) Tied to GND 1.8V Power Supply Input Clock (SPI) Data Line (SPI) External Resistor for Gain Tempco Control Bus Enable (active low, SPI) RF Output No Connect External Inductor for LNA Ground DESCRIPTION
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Overcoming Noise or Interference Using the QHx220
Identifying Common Sources of Electromagnetic Interference (EMI)
* A flex cable carrying high-speed data from a base-band processor to an LCD/Camera display. * Closely spaced antennas of radios operating simultaneously. * Harmonics, other mixing products or spurs that fall within the victim receive band. * Poor isolation from local transmitter (via antennas, duplexers or other front end modules). * Noise on common Ground or VCC supply lines.
Acquiring and Sampling the Source of Unwanted Interference
Intersil's QHx220 reduces EMI by sampling the interference source at its input. The sampled noise signal is acquired in close proximity to the noise source either with an EMI detector, an additional coupling element on the PCB or direct tap of the noise source using a RC network.
Emulating the Coupling Channel to Achieve an Inverse Signal
Once the QHx220 acquires and samples the unwanted interferer, the general-purpose canceller feeds the sampled noise signal through an analog signal processor, which allows control of the phase within 360 and the amplitude within a dynamic range of 50dB. This enables the QHx220 to output an inverse signal of the interference plus coupling channel in order to eliminate the desensitization of the victim receiver.
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Absolute Maximum Ratings
Supply Voltage (VDD to GND) . . . . . . . . . . . . . . . . . . .2.1V I/O Voltage at All Input Pins . . . . GND - 0.3V to VDD + 0.3V ESD Rating (HBM) . . . . . . . . . . . . . . . . . . . . . . . . . . . 2kV
Thermal Information
Thermal Resistance (Typical) JA (C/W) JC (C/W) 16 Ld QFN Package (Notes 3, 4) . . 60 13 Operating Ambient Temperature Range . . . . -40C to +85C Storage Ambient Temperature Range . . . . -55C to +150C Maximum Junction Temperature . . . . . . . . . . . . . . . +125C Pb-free reflow profile . . . . . . . . . . . . . . . . . . .see link below http://www.intersil.com/pbfree/Pb-FreeReflow.asp
CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product reliability and result in failures not covered by warranty.
NOTES: 3. JA is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details. 4. For JC, the "case temp" location is the center of the exposed metal pad on the package underside.
Operating Conditions
PARAMETER Supply Voltage Operating Ambient Temperature Power Consumption (operation mode) Power Consumption (standby mode) NOTE: 5. Max Power specifications tested under ECC test conditions. SYMBOL VDD TA @high/low gain mode @boost gain mode CONDITION MIN 1.7 -40 TYP 1.8 25 16 23 10 MAX 1.9 85 28.7 33 38.3 UNITS V C mW mW W 5 5 5 NOTES
Control Pin Characteristics
PARAMETER Logic Input Level - Low Enable Response Time Disable Response Time Control Word Length Bits 0-9 Bits 10-19 Bits 20-21 SYMBOL ENBAR low
Typical values are at VDD = 1.8V, TA = +25C, and PIN = < -48dBm, unless otherwise noted. Extreme Characterization Conditions (ECC) are VDD = 1.7V to 1.9V, TA = -40C to +85C. CONDITION MIN 0.8 VDD Delay following high to low transition until RF output is within 10% of its final value. Delay following low to high transition until RF output is within 10% of its final value. I-DAC value Q-DAC value Application select 00: UHF-Band 01: L-Band 11: ISM Band 535 350 24 10 10 TYP MAX 0.2 VDD UNITS NOTES mV V ns ns Bits Bits Bits 6
Logic Input Level - High ENBAR high
Bit 22 Bit 23 (Note 18) NOTES:
Gain Switch Extended Feature
1 1
Bit Bit 7
6. The enable response time is bounded by the input AC cap on board. Typical response time reflects 100pF capacitance. 7. Generally set to low. Two successive SPI instructions are needed to enable or disable boost gain mode. Sequence to enable boost gain mode 1st instruction: set Bit<23:20> to 1x01'b 2nd instruction: set Bit<23:20> to 0xxx'b Sequence to disable boost gain mode 1st instruction: set Bit<23:20> to 1x10'b 2nd instruction: set Bit<23:20> to 0xxx'b
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SPI Bus Characteristics
TBEB2C TC2BEB
CLK
TCH TCP
TCL
BUSENBAR
24BIT
DATA
MSB LSB
TDH TDS
Data register lock
FIGURE 2. SPI BUS TIMING DIAGRAM
SPI BUS TIMING REQUIREMENT
SYMBOL tCP tCL tCH tBEB2C tC2BEB tDS tDH SPI clock period Clock pulse width low Clock pulse width high BUSENBAR Fall to CLK Rise Setup Time CLK Rise BUSENBAR Fall Delay Data Setup Time Data Hold Time PARAMETER MIN 100ns 40ns 40ns 5ns 40ns 20ns 0ns TYP MAX
TABLE 1. SPI BUS DATA FORMAT 10BIT I-DAC <23:14> 10BIT Q-DAC <13:4> FREQ RANGE <3:2> GAIN <1> SPARE <0>
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Power ON/OFF Sequence
Power ON
Slope1: >1.8V/50ms VDDA & VDDA2
0V
Power ON
1.8V
t1>0
ENBAR
Low
t2>250s
BUS ENABLE
Low
CLK
Low
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
DATA
Low
MSB 23
22
21
20
19
18
17
16
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
LSB 0
I-DAC (10 bits: 0111111111)
Q-DAC (10 bits: 0111111111)
Freq. Range Gain (MTV: 00) (0)
Spare (0)
(This command sets QHx220 into minimum gain (Note 8))
Power OFF
Power OFF VDDA & VDDA2
1.8V
Slope2: >1.8V/50ms
0V
ENBAR
Low
BUS ENABLE
Low
CLK
Low
DATA
Low
NOTES: 8. When the chip is powered up its register are all zero. This means -135 phase and full analog gain, WLAN Application and 0dB coarse gain (the boost gain mode is not enabled). 9. VDDA and VDDA2 should be connected on the PCB and decoupled with caps right next to the pin. 10. The SPI Bus is not accessible when VDDA/VDDA2 are <1V.
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Electrical Specifications
Typical test conditions (TTC) VDD = 1.8V, TA = +25C, and PIN < -48 dBm, unless otherwise noted. Extreme Characterization Conditions (ECC) are VDD = 1.7V to 1.9V, TA = -40C to +85C. Output load test condition is 50 in parallel with 50 unless otherwise stated. Electrical specifications reflect performance of QFN packaged devices. CONDITION MIN 0.3 UHF-Band 450MHz/770MHz L-Band 1575MHz ISM Band 2400MHz Max. Gain (low gain mode) UHF-Band 450MHz/770MHz L-Band 1575MHz ISM Band 2400MHz Max. Gain (Boost gain mode) UHF-Band 450MHz/770MHz L-Band 1575MHz ISM Band 2400MHz Max Dynamic Range Phase Control Range Absolute Gain Accuracy over ECC UHF-Band 450MHz/770MHz L-Band 1575MHz ISM Band 2400MHz IIP3 of Sampler Input (high gain mode) UHF-Band 450MHz/770MHz L-Band 1575MHz ISM Band 2400MHz IIP3 of Sampler Input (low gain mode) UHF-Band 450MHz/770MHz L-Band 1575MHz ISM Band 2400MHz IIP3 of Sampler Input (Boost high gain mode) UHF-Band 450MHz/770MHz -46.3/-34.5 L-Band 1575MHz ISM Band 2400MHz Output Noise Power (high gain mode) UHF-Band 450MHz/770MHz L-Band 1575MHz ISM Band 2400MHz Output Noise Power (low gain mode) UHF-Band 450MHz/770MHz L-Band 1575MHz ISM Band 2400MHz Output Noise Power (Boost high gain mode) UHF-Band 450MHz/770MHz L-Band 1575MHz ISM Band 2400MHz LNA Noise Figure (high gain mode) UHF-Band 450MHz/770MHz L-Band 1575MHz ISM Band 2400MHz -40.48 -35.1 -34.8 -34.7/-24.7 -31.3 -20.75 -33.4/-25.1 -31.5 -23 -42.8/-31.0 -36.98 -24 -158.8/-164.1 -161.7 -168.7 -168.6/-171.6 -169.8 -173.1 -153.9/-160.5 -156.1 -164.7 1.5 1.5 2.0 27.4 0 -2.5 -2.5 17.1/9.2 14.7 -7.2/-15.4 -5.4 8.4/-3 7.3 14.9/8.0 12.0 2.0 2.8/-4.1 0.9 -9.1 20.1/12.2 17.7 7.64 50 360 1.5 1.5 23.1/15.2 20.7 7.3/1.4 4.9 TYP MAX 3 18/11.8 16.3 UNITS GHz dB dB dB dB dB dB dB dB dB dB dB dB dB dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm/Hz dBm/Hz dBm/Hz dBm/Hz dBm/Hz dBm/Hz dBm/Hz dBm/Hz dBm/Hz dBm dBm dBm 13, 18 13, 18 13, 18 18 18 18 18 18 18 18 18 18 14, 18 14, 18 14, 18 14, 18 14, 18 14, 18 14, 18 14, 18 14, 18 15, 18 15, 18 15, 18 NOTES 11 12 12 12 12 12 12 12 12 12
PARAMETER Frequency Coverage Max. Gain (high gain mode)
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Electrical Specifications
Typical test conditions (TTC) VDD = 1.8V, TA = +25C, and PIN < -48 dBm, unless otherwise noted. Extreme Characterization Conditions (ECC) are VDD = 1.7V to 1.9V, TA = -40C to +85C. Output load test condition is 50 in parallel with 50 unless otherwise stated. Electrical specifications reflect performance of QFN packaged devices. (Continued) CONDITION UHF-Band 450MHz/770MHz L-Band 1575MHz ISM Band 2400MHz Input Reflection Coefficient (low gain) UHF-Band 450MHz/770MHz L-Band 1575MHz ISM Band 2400MHz Input Reflection Coefficient (Boost high gain) UHF-Band 450MHz/770MHz L-Band 1575MHz ISM Band 2400MHz RF Output Impedance (Rp//Cp) UHF-Band 450MHz/770MHz L-Band 1575MHz ISM Band 2400MHz Output Insertion Loss UHF-Band 450MHz/770MHz L-Band 1575MHz ISM Band 2400MHz NOTES: 11. Part will operate under the specified frequency ranges. Electrical performance is not optimal beyond the UHF-Band (low end) and ISM Band (high end). 12. Data provided for external tank circuit with Q2 and fcenter550MHz. 13. Extreme corner conditions (ECC) are VDD = 1.7V to 1.9V, TA = -40C to +85C. 14. Input connected to a 50 load during measurement. 15. NF improves beyond high gain when going into boost gain. Values not tested on ATE. 16. S11 based upon single series inductor matching. 17. Rp//Cp given at typical gain point of canceller. 18. Limits established by characterization and not production tested. MIN TYP -1.0/-2.6 -0.06 -2.3 -1.3/-2.5 -0.3 -2.1 -1.0/-2.7 2.4 -1.0 Rp = 6.9/4.6, Cp = 620/616 Rp = 2.2, Cp = 619 Rp = 1.0, Cp = 680 0.1 0.3 0.7 MAX UNITS dBm dBm dBm dB dB dB dB dB dB k, fF k, fF k, fF dB dB dB NOTES 15, 18 15, 18 15, 18 16, 18 16, 18 16, 18 16, 18 16, 18 16, 18 17, 18 17, 18 17, 18 18 18 18
PARAMETER Input Reflection Coefficient (high gain)
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Typical Performance Characteristics (UHF-Band)
Plots are exemplary only, to show typical performance and provide a frame of reference. Typical test conditions (TTC) VDD = 1.8V, TA = +25C, and PIN < -48dBm, unless otherwise noted. Extreme Characterization Conditions (ECC) are VDD = 1.7V to 1.9V, TA = -40C to +85C.
ATTENUATION @750MHz
VCTRLb VCTRLa
FIGURE 3. 3D ATTENUATION PLOT FOR GAIN AND PHASE FAMILY OF CURVES
FIGURE 4. 2D CONTOUR PLOT FOR GAIN AND PHASE FAMILY OF CURVES IN HIGH BOOST MODE (RED CIRCLE = UNITY GAIN)
GAIN vs TEMPERATURE AT 770MHz Vctrl_a = Vctrl_b = 0V 10 8 6 4 GAIN (dB) 2 0 -2 -4 -6 -8 -40 LG VDD = 1.7V -5 25 55 TEMPERATURE (C) 85 LG VDD = 1.8V LG VDD = 1.9V HG VDD = 1.7V HG VDD = 1.9V HG VDD = 1.8V
FIGURE 5. GAIN vs FREQUENCY AT LOW, MID, HIGH, AND BOOST GAIN SET POINTS
FIGURE 6. GAIN VARIATION UNDER ECC MEASURED AT 770MHz AT MAX GAIN SET-POINT
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Typical Performance Characteristics (UHF-Band) (Continued)
Plots are exemplary only, to show typical performance and provide a frame of reference. Typical test conditions (TTC) VDD = 1.8V, TA = +25C, and PIN < -48dBm, unless otherwise noted. Extreme Characterization Conditions (ECC) are VDD = 1.7V to 1.9V, TA = -40C to +85C.
PHASE vs TEMPERATURE AT 770MHz Vctrl_a = Vctrl_b = 0V LG VDD = 1.8V HG VDD = 1.8V HG VDD = 1.9V HG VDD = 1.7V LG VDD = 1.7V LG VDD = 1.9V IIP3 (dBm) IIP3 vs TEMPERATURE at 770MHz Vctrl_a = Vctrl_b = 0V
222 220 218 PHASE () 216 214 212 210 208 206 204 -40
-18 -20 -22 -24 -26 -28 -30
HG VDD = 1.8V HG VDD = 1.7V HG VDD = 1.9V
LG VDD = 1.7V LG VDD = 1.8V LG VDD = 1.9V
-5
25
55
85
-32
-40
-5
25
55
85
TEMPERATURE (C)
TEMPERATURE (C)
FIGURE 7. PHASE VARIATION UNDER ECC MEASURED AT 770MHz AT MAX GAIN SET-POINT
FIGURE 8. IIP3 VARIATION UNDER ECC MEASURED AT 770MHz AT MAX GAIN SET-POINT
FIGURE 9. PHASE COVERAGE FOR GAIN AND PHASE FAMILY OF CURVES
FIGURE 10. NOISE FLOOR FOR GAIN AND PHASE FAMILY OF CURVES vs FREQUENCY
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Typical Performance Characteristics (UHF-Band) (Continued)
Plots are exemplary only, to show typical performance and provide a frame of reference. Typical test conditions (TTC) VDD = 1.8V, TA = +25C, and PIN < -48dBm, unless otherwise noted. Extreme Characterization Conditions (ECC) are VDD = 1.7V to 1.9V, TA = -40C to +85C.
MTV Noise Plot
-155 -157 -159 -161 -163 -165 -167 -169 -171 -173 -175 -177 0.00 0.40 0.70 0.65 1.00 1.40
Average Noise Power (dBm/Hz)
1.2 0.7 0.0
-157--155 -159--157 -161--159 -163--161 -165--163 -167--165 -169--167 -171--169 -173--171 -175--173 -177--175
SUPPLY CURRENT vs TEMPERATURE AT 770MHz 11.0 10.5 1.0 9.5 IDD (mA) 9.0 8.5 8.0 7.5 7.0 6.5 6.0 -40 HG VDD = 1.9V HG VDD = 1.7V HG VDD = 1.8V LG VDD = 1.7V LG VDD = 1.9V LG VDD = 1.8V -5 25 55 85
Control B (V)
Control A (V)
TEMPERATURE (C)
FIGURE 11. 3D NOISE FLOOR PLOT FOR GAIN AND PHASE FAMILY OF CURVES @ 750MHz
FIGURE 12. SUPPLY CURRENT VARIATION UNDER ECC
Typical Performance Characteristics (L-Band)
Plots are exemplary only, to show typical performance and provide a frame of reference. Typical test conditions (TTC) VDD = 1.8V, TA = +25C, and PIN < -48dBm, unless otherwise noted. Extreme Characterization Conditions (ECC) are VDD = 1.7V to 1.9V, TA = -40C to +85C.
ATTENUATION @750MHz
VCTRLb
VCTRLa
FIGURE 13. 3D CONTOUR PLOT FOR GAIN AND PHASE FAMILY OF CURVES IN HIGH GAIN MODE
FIGURE 14. 2D CONTOUR PLOT FOR GAIN AND PHASE FAMILY OF CURVES IN HIGH BOOST MODE (RED CIRCLE = UNITY GAIN)
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Typical Performance Characteristics (L-Band) (Continued)
Plots are exemplary only, to show typical performance and provide a frame of reference. Typical test conditions (TTC) VDD = 1.8V, TA = +25C, and PIN < -48dBm, unless otherwise noted. Extreme Characterization Conditions (ECC) are VDD = 1.7V to 1.9V, TA = -40C to +85C.
GAIN VS TEMPERATURE AT 1575MHZ Vctrl_a = Vctrl_b = 0V 14 12 10 GAIN (dB) 8 6 4 2 0 -2 LG VDD = 1.7V -40 -5 25 55 85 LG VDD = 1.8V LG VDD = 1.9V HG VDD = 1.7V HG VDD = 1.8V HG VDD = 1.9V
TEMPERATURE (C)
FIGURE 15. GAIN vs FREQUENCY AT LOW, MID, HIGH, AND BOOST GAIN SET POINTS
FIGURE 16. GAIN VARIATION UNDER ECC MEASURED AT 1575MHz AT LOW GAIN AND HIGH GAIN SET-POINTS
230
PHASE vs TEMPERATURE AT 1575MHz Vctrl_a = Vctrl_b = 0V LG VDD = 1.8V -26 -28 LG VDD = 1.7V IIP3 (dBm) LG VDD = 1.9V HG VDD = 1.7V -30 -32 -34 -36 -38 55 85 -40 -40
IIP3 vs TEMPERATURE AT 1575MHz Vctrl_a = Vctrl_b = 0V
225
HG VDD = 1.7V LG VDD = 1.7V LG VDD = 1.8V LG VDD = 1.9V HG VDD = 1.8V HG VDD = 1.9V
PHASE ()
220
215 HG VDD = 1.9V 210 HG VDD = 1.8V
205
-40
-5
25
-5
25
55
85
TEMPERATURE (C)
TEMPERATURE (C)
FIGURE 17. PHASE VARIATION UNDER ECC MEASURED AT 1575MHz AT LOW GAIN AND HIGH GAIN SET-POINTS
FIGURE 18. IIP3 VARIATION UNDER ECC MEASURED AT 1575MHz AT LOW GAIN AND HIGH GAIN SET-POINTS
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Typical Performance Characteristics (L-Band) (Continued)
Plots are exemplary only, to show typical performance and provide a frame of reference. Typical test conditions (TTC) VDD = 1.8V, TA = +25C, and PIN < -48dBm, unless otherwise noted. Extreme Characterization Conditions (ECC) are VDD = 1.7V to 1.9V, TA = -40C to +85C.
FIGURE 19. PHASE COVERAGE FOR GAIN AND PHASE FAMILY OF CURVES vs FREQUENCY
FIGURE 20. NOISE FLOOR FOR GAIN AND PHASE FAMILY OF CURVES vs FREQUENCY
SUPPLY CURRENT vs TEMPERATURE AT 1575MHz
GPS Noise Plot
-155 -157 -159 -161 -163 -165 -167 -169 -171 -173 -175 -177 0.00 0.40 0.70 0.65 1.00 1.40
Average Noise Power (dBm/Hz)
1.2 0.7 0.0
-157--155 -159--157 -161--159 -163--161 -165--163 -167--165 -169--167 -171--169 -173--171 -175--173 -177--175
11.0 10.5 10.0 9.5 IDD (mA) 9.0 8.5 8.0 7.5 7.0 6.5 6.0 -40 LG VDD = 1.7V LG VDD = 1.8V LG VDD = 1.9V HG VDD = 1.7V HG VDD = 1.8V HG VDD = 1.9V
Control B (V)
-5
25
55
85
Control A (V)
TEMPERATURE (C)
FIGURE 21. 3D NOISE FLOOR PLOT FOR GAIN AND PHASE FAMILY OF CURVES @ 1575MHz
FIGURE 22. SUPPLY CURRENT VARIATION UNDER ECC
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Typical Performance Characteristics (ISM Band)
Plots are exemplary only, to show typical performance and provide a frame of reference. Typical test conditions (TTC) VDD = 1.8V, TA = +25C, and PIN < -48dBm, unless otherwise noted. Extreme Characterization Conditions (ECC) are VDD = 1.7V to 1.9V, TA = -40C to +85C.
ATTENUATION @750MHz
VCTRLb
VCTRLa
FIGURE 23. 3D ATTENUATION PLOT FOR GAIN AND PHASE FAMILY OF CURVES vs FREQUENCY
FIGURE 24. 2D CONTOUR PLOT FOR GAIN AND PHASE FAMILY OF CURVES IN BOOST MODE (RED CIRCLE = UNITY GAIN)
FIGURE 25. GAIN vs FREQUENCY AT LOW, MID, HIGH, AND BOOST GAIN SET POINTS
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Typical Performance Characteristics (ISM Band) (Continued)
Plots are exemplary only, to show typical performance and provide a frame of reference. Typical test conditions (TTC) VDD = 1.8V, TA = +25C, and PIN < -48dBm, unless otherwise noted. Extreme Characterization Conditions (ECC) are VDD = 1.7V to 1.9V, TA = -40C to +85C.
FIGURE 26. PHASE COVERAGE FOR GAIN AND PHASE FAMILY OF CURVES
FIGURE 27. NOISE FLOOR FOR GAIN AND PHASE FAMILY OF CURVES vs FREQUENCY
WLAN Noise Plot
-155 -157 -159 -161 -163 -165 -167 -169 -171 -173 -175 -177 -179 0.00 0.40 0.70 0.65 1.00 1.40
1.2 0.7 0.0
-157--155 -159--157 -161--159 -163--161 -165--163 -167--165 -169--167 -171--169 -173--171 -175--173 -177--175 -179--177
Average Noise Power (dBm/Hz)
Control B (V)
Control A (V)
FIGURE 28. 3D NOISE FLOOR PLOT FOR GAIN AND PHASE FAMILY OF CURVES @ 2.4GHz
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FIGURE 29. BLOCK DIAGRAM
Operation
The architecture of the QHx220 is similar to that of a linear vector modulator. A SPI bus interface is used to control the internal 10-bit DACs, which in turn control the VGAs in the RF-path. The VGA settings sett the I and Q of a vector modulator and provide full control over the magnitude and phase of the output cancellation signal. The SPI interface is also used to control internal LNA gain stages at the sampler input, which can provide additional gain when sampling weaker noise sources. The QHx220 allows for a full 360 phase control and up to 50 dB of dynamic range of the input RF signal. This tuning range is used to emulate the RF noise coupling channel that is present between the noise source and victim receiver. The noise coupling channel can be radiated from the noise source to the victim receive antenna or via some other leakage path to the receiver - most often it is a combination of the two.
FIGURE 30. POLAR PLOT
Figure 30 illustrates the gain and phase control provided by the vector modulator. The coverage map is represented in polar form. In practice it is not possible to reach origin at the minimum gain setting, which represents a gain of zero. This is due to the isolation limitations that exist in any device. Thus it is not possible to completely eliminate that signal in the forward path, resulting in minimum gain levels in the order of -45dBm or -55dBm.
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FN6986.0 October 20, 2009
QHx220
Evaluation Board
General purpose evaluations boards are available for the QHx220 devices. They allow for basic functional testing of the IC. However, more importantly they are designed to be easily integrated into customer applications as an RF daughter card for initial proof of concept. The QHx220 has internal pre-amplification
gain stages that can be used to amplify the sampled noise signal if additional gain is required to emulate the noise coupling channel. There are also internal DACs to control the amplitude and phase (I and Q) of the device. A software control GUI is provided to enable control of the device.
GND
1.8V INPUT
LED
Rx INPUT (FROM ANTENNA)
NOISE SAMPLER INPUT
Rx OUTPUT (TO RECEIVER)
QHx220
SPI INTERFACE FIGURE 31. EVALUATION BOARD
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QHx220
Software GUI
A software interface is provided to facilitate the control of the evaluation board. The GUI can be used to control of the internal gain stages and DACs via a SPI bus interface. These two control signals are also referenced to as "I" (in phase") and "Q" (quadrature phase) control in the user interface. The QHx220 controller software is an application that uses the USB port of a PC to emulate the SPI bus communications to device. The initial user interface will look like the following:
The left tab within the window allows the user to directly set or sweep the I and Q values that control the QHx220. The right tab allows the user to control the Phase & Amplitude (which is simply a mathematical conversion of the I and Q values). Similarly to the I and Q panel, the Phase & Amplitude panel can be used to set or sweep the amplitude and phase of the QHx220 and is often a more intuitive approach to performing the optimization. In both cases a small window appears in the bottom right corner to illustrate the alternate I & Q or Phase and Amplitude representation.
About Q:ACTIVE
Q:ACTIVE Technology is behind Intersil's ability to insert its ICs inside radios, automotive infotainment systems, satellite broadcast equipment, and various consumer electronic devices such as GPS units, cell phones, and portable gaming systems. By doing so, Intersil achieves the ability to reduce electromagnetic interference by as much as 30dB. This breakthrough in radio sensitivity allows for several signals to run simultaneously and enables new technologies such as mobile TV on hand held games, cell phones, and in automotive systems.
FIGURE 32. SOFTWARE GUI
For additional products, see www.intersil.com/product_tree Intersil products are manufactured, assembled and tested utilizing ISO9000 quality systems as noted in the quality certifications found at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com 18
FN6986.0 October 20, 2009
QHx220
Package Outline Drawing
L16.3x3B
16 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE Rev 1, 4/07
4X 1.5 3.00 A B 6 PIN 1 INDEX AREA 13 12X 0.50 16 6 PIN #1 INDEX AREA
12
1
3.00
1 .70
+ 0.10 - 0.15
9
4
(4X)
0.15 8 5 0.10 M C A B 4 16X 0.23 - 0.05 16X 0.40 0.10
+ 0.07
TOP VIEW
BOTTOM VIEW
SEE DETAIL "X"
0.10 C
0 . 90 0.1 BASE PLANE ( 2. 80 TYP )
C
SEATING PLANE 0.08 C
SIDE VIEW
( 1. 70 ) ( 12X 0 . 5 )
( 16X 0 . 23 ) C 0 . 2 REF
5
( 16X 0 . 60)
0 . 00 MIN. 0 . 05 MAX.
TYPICAL RECOMMENDED LAND PATTERN
DETAIL "X"
NOTES: 1. Dimensions are in millimeters. Dimensions in ( ) for Reference Only. 2. Dimensioning and tolerancing conform to AMSE Y14.5m-1994. 3. Unless otherwise specified, tolerance : Decimal 0.05 4. Dimension b applies to the metallized terminal and is measured between 0.15mm and 0.30mm from the terminal tip. 5. Tiebar shown (if present) is a non-functional feature. 6. The configuration of the pin #1 identifier is optional, but must be located within the zone indicated. The pin #1 identifier may be either a mold or mark feature.
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FN6986.0 October 20, 2009

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